CCH Target Manufacturing Concepts

In the late 1980's Praxair MRC pioneered the development of its CCH material technology having realized that there was a strong interrelation between the cathode and the metallurgical structure of the sputtering target. The philosophy was to develop sputtering target materials that can be produced in a Controlled manner in order to provide Consistent and High performance levels. The program began with the development of CCH Al and Al alloys and has been further applied to other sputtering target materials used in semiconductor wafer fabs.


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CCH technology involves thermomechanical processing of target materials. Production processes have been optimized for the nature and degree of deformation and the application of heat treatment cycles. This fundamental technology has been field proven and applied across all cathode types from the major equipment manufacturers. The technology has been applied to Praxair MRC's range of aluminum alloy, titanium, tungsten-titanium, tantalum, copper, nickel vanadium, cobalt and nickel targets.

Early developments in the PVD industry indicated that material crystallographic orientation was an important factor. Praxair MRC furthered this work by optimizing target performance by metallurgically "tuning" target microstructure in terms of microstructure, grain size and second phase precipitate structure, and crystallographic texture.

Each metal and alloy has received its own optimization and the response is different material to material. The end result of this optimization is a uniform and consistent fine grain structure with a crystallographic texture that has been identified to be ideal for each specific cathode. Target materials produced via the CCH processes have been qualified and certified by OEM tool manufacturers such as Applied Materials, Novellus and TEL and proven in wafer fabs across the world.


CCH Process
CCH Do Aluminum Alloys
CCH Do and Do* Ti
Co and Ni
Ta and Cu

Thin Films Application Lab
Bonding Technology
Novellus Inova™ Tool
Endura™ & Centura™ Systems
RE-Al PLUS": Sputter Targets
Technical Papers  
  1. Reduction of TiN Nodule Density Through Optimization of Cathode and Process Variables
  2. Effect of Oxygen Content on Particle Generation in TiN Reactive Sputtering
  3. Link From Titanium Target Orientation to Titanium/Titanium Nitride/Aluminum Thin Film Orientations
  4. Technical Papers Available in PDF