INK JET

Al-Cu Alloy

Application:
Aluminum alloy with low electromigration resistance is needed for interconnect applications.

Material Requirements:
Al-0.5%Cu alloy is a well known interconnect material used in semiconductor microintegrated circuit manufacturing. Low Rs uniformity and consistency of thin films deposited from targets are the key requirements.

Praxair MRC Al-0.5% Cu Specifications:

MRC Spec.
Al 10
Ca 10
Cu  
Co  
Cr 50
Fe 50
K 5
Li 5
Mg 10
Mn  
Mo 50
Na 5
Ni  
Si 25
Ti  
Nb 300
W 25
Th  
U  
O 200
N 20
   
 
Tantalum Targets
Tantalum-Aluminum Alloys
Al-Cu Alloy
Gold Targets