SEMICONDUCTOR APPLICATIONS

Technical Papers

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Evolution of Aluminum Target Orientation and its Influence on Deposited Film Uniformity at the Early Life Sputtering

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Enhanced Targets Can Reduce Metallisation Cost of Ownership - A Case Study

Metallurgy of Aluminum Alloy Sputtering Targets
Technical Note No. 200

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      - full text, tables 1 & 2, figures 1 & 2
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      - figures 3 & 4a
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      - figures 4b, 4c & 4d
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      - figures 4e, 4f & 5
    • pages 20-25 @ 736 KB - download now
      - figures 6 to 11
    • pages 26-32 @ 158 KB - download now
      - figures 12 to 18, copyright, disclaimer

The Effect of Titanium Target Grain Size on Sputtering Performance
Technical Note No. 201

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    • pages 13-24 @ 817 KB - download now
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Tungsten Titanium Targets for VLSI Device Fabrication
Technical Note No. 202

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      - full text, figures 1 to 4
    • pages 13-18 @ 682 KB - download now
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Tungsten-Titanium Sputtering Target Technology
Technical Note No. 203

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The Role of Tungsten-Titanium Target Density on Particulate Generation
Technical Note No. 1263

   
 
CCH Process
CCH Do Aluminum Alloys
CCH Do and Do* Ti
Co and Ni
Ta and Cu
Bonding Technology
Novellus Inova™ Tool
Endura™ & Centura™ Systems
Technical Papers  
  1. Reduction of TiN Nodule Density Through Optimization of Cathode and Process Variables
  2. Effect of Oxygen Content on Particle Generation in TiN Reactive Sputtering
  3. Link From Titanium Target Orientation to Titanium/Titanium Nitride/Aluminum Thin Film Orientations
  4. Technical Papers Available in PDF